Highcon @ FESPA – Hall 5.2 Booth D-21

  • May 15-18 2018
  • Berlin
We will be showing our latest corrugated samples digitally cut & creased on the Highcon Euclid IIIC at our customer site, LxBxH Verpackungen nach Mass, Switzerland.

Visit the Highcon booth #D21 at the 2018 FESPA event in Berlin!

We will be showing our latest corrugated samples digitally cut & creased on the Highcon Euclid IIIC at our customer site, LxBxH Verpackungen nach Mass, Switzerland.
Our samples demonstrate many of the Highcon Euclid IIIC capabilities – including digital creasing, cutting, perforations, zipper tears, half cuts and special decoration elements.

 

Order your corrugated covered Laderach chocolate box!

The corrugated sleeve produced on the Highcon Euclid IIIC. 
Fill in your details below, and the box will be waiting to you on our booth hall 5.2 stand D-21.

 

 

 

 

 

Meet, Drink & Chat with Silvano Gauch – President, LxBxH Verpackungen nach Mass!

On Tuesday & Wednesday 16th and 17th May, between 13:30 – 15:00 at the Highcon booth – we invite you to a beer and chat with Silvano Gauch, President of LxBxH to talk about his day-to-day work with the Highcon Euclid IIIC for corrugated board. Silvano will answer your questions about machine capabilities, benefits, daily workflow and other pecifications.

 

 

To order your corrugated covered chocolate box, or to meet with Silvan Gauch, president of LxBxH, simply fill in your details in the form below.
We will than contact you by email with your confirmation of request.
The box will be waiting for you with your name at the Highcon booth – throughout the FESPA show.
(Please note the quantity is limited for the first 200 people who register).

Share Event post

More Events

post-image
Visit Us at The Next Technical General Meeting of VDW 2024
    12:06:32
  • November 18th - 19th, 2024
  • Seeheim-Jugenheim, Germany

More Info
post-image
Meet us at Fachpack 2024
    15:39:03
  • September 24th - 26th, 2024
  • Nurnberg, Germany

Fachpack 2024 - the European trade fair for packaging, technology and processes. Discover innovations, exchange ideas and be inspired. Don't miss it!

More Info
post-image
Highcon Presenting at the Innovative Packaging Conference in Poland
    15:57:23
  • October 15 - 16, 2024
  • Poland

More Info
Skip to content