Meet us at Innovative Packaging 2024, the annual conference for the solid board packaging industry.
This year’s event will be held at Jastrzębia Góra in Poland on October 15-16, 2024.
We’re happy to collaborate with our esteemed partner Digiprint for a panel discussion titled “From Concept to a Box: An Industrial Digital Line for Packaging Production.”
For more information about the event, click here or contact us at [email protected].
Join Highcon at the UK Corrugated Industry Trade Show 2024 to explore innovative digital die cutting solutions
Highcon at ScanPack, the leading exhibition and meeting place for the Scandinavian packaging industry