From Concept to Box: Digital for Packaging Production
- December 16, 2024
The Innovative Packaging Conference, recently held in Poland and hosted by Digiprint, Highcon’s partner in the region, brought together industry leaders to discuss advancements in print and packaging technology. A standout session, titled “From Concept to Box: Digital for Packaging Production,” explored the impact of digital workflows on print and packaging. Bartosz Nowakowski, Poland Country …
Transforming Packaging with Highcon: A Schumacher Packaging Success Story
- October 9, 2024
In the fast-evolving packaging industry, staying ahead demands packaging innovation, efficiency and sustainability. Schumacher Packaging, a family-owned leader specializing in customized corrugated packaging and solid board, embodies this approach. With over 29 sites across Europe, Schumacher Packaging has consistently invested in advanced technologies to meet the shifting demands of the market. A pivotal step in this …
THIMM’s Award-Winning Packaging Solutions with Highcon Technology
- September 1, 2024
THIMM, a leader in innovative packaging solutions, recently secured impressive wins at the OBAL ROKU 2024 National Competition for Packaging Innovations and Design. The jury, comprised of experts, evaluated entries based on innovation, functionality, technical processing, design, and sustainability. Among THIMM’s triumphs were two standout packaging solutions—G(o)rila Box for Orkla Foods Czech Republic and Slovkia …