Yavne, Israel and Fremont Calif, January 21, 2021: Highcon Systems Ltd. and EFI™ announced today that the two companies have entered into a global partnership agreement. With a common group of core customers, together with EFI’s ability to deliver industry-focused ERP software solutions, the goal is to offer customers an integrated, end-to-end business productivity and workflow solution, providing a flexible foundation for digital growth.
The industry leading EFI Packaging and Corrugated Suites deliver off the shelf productivity benefits that target specific business areas to reduce waste and inefficiency in the packaging production process, driving cost savings with integrated eCommerce, ERP and shop floor data collection.
In the coming Highcon Euclid and Beam software release, Highcon customers will be able to integrate with the EFI MarketDirect PackCentral online customer ordering portal and EFI Auto-Count® 4D software, which automatically collects accurate, up-to-the-minute production data for digital presses and cutting devices.
This exciting partnership will significantly improve lead times for printed material development by delivering a fully optimized supply chain that brings together buyers, converters, and digital converting equipment through robust two-way connectivity. This comprehensive platform delivers real value to businesses looking to improve efficiency, manage and optimize paper and inventory, reduce process waste and improve profits by leveraging automation.
Ken Hanulec, EFI VP Worldwide Marketing said: “We see the digital corrugated market as being a strong growth area. The EFI Nozomi solutions have really begun revolutionizing the industry and as part of our holistic view of the marketplace we identified Highcon as being the leader in the next step in the digital process – digital finishing. Their digital cutting and creasing solutions enable the kind of on-demand production that drives customer success. We are excited about the potential of addressing the market together.”
Gaby Matsliach, Senior VP, General Manager, EFI Productivity Software added: “At EFI we have constantly focused our efforts on driving customer productivity and have released a comprehensive Suite of productivity solutions for the packaging industry. I have been impressed by Highcon’s similar drive for customer efficiency and we are delighted to partner with them in optimizing digital procurement and production workflows.”
Shlomo Nimrodi, Highcon CEO said: “We are excited about working with EFI towards a genuinely end-to-end digital solution, Nozomi and Beam platforms, coupled with workflow automation that will answer the market needs for sustainability and Industry 4.0 manufacturing efficiencies. Collaboration with other industry players in the digital space is a critical part of our go to market strategy and we will continue to drive this strategy demonstrating our commitment to provide the best comprehensive solution to the inherent limitations in the conventional process.”
EFI™ is a global technology company, based in Silicon Valley, and is leading the worldwide transformation from analogue to digital imaging. We are passionate about fuelling customer success with products that increase competitiveness and boost productivity. To do that, we develop breakthrough technologies for the manufacturing of signage, packaging, textiles, ceramic tiles, building materials and personalised documents, with a wide range of printers, inks, digital front ends, and a comprehensive business and production workflow suite that transforms and streamlines the entire production process. (www.efi.com)
Highcon and Menasha have signed a LOI reflecting their intent to partner on the integration of new Highcon systems over the next 24 months.