Highcon is excited to be among the exhibitors at the 30th TMV Technical General Meeting of VDW, the German Association of the Corrugated Board Industry.

With a wide presence from the German corrugated and printing industries, this year’s event will take place on 18-19 November 2024, at the Lufthansa Seeheim GmbH in Seeheim-Jugenheim, Germany.

We invite you to meet us at our booth #8 and discuss how Highcon’s digital cutting and creasing systems for production and converting of corrugated board can provide an innovative solution to help you improve your business.

Don’t miss our spotlight session on Mainstreaming Digital Die Cutting and learn about our technology’s tooling-free die cutting capabilities and its impact on the industry, including zero lead time solutions. The full agenda will be published soon.

If you want to learn more, click here and we will contact you shortly.

We look forward to connecting with you soon!