Join Highcon at Sun Automation’s booth #1731 during this year’s SuperCorrExpo at the Orange County Convention Center in Orlando, Florida, from September 8th to 12th, 2024.
Get Ready for the Mainstreaming of Digital Die Cutting!
Come and meet the Highcon team to learn all about our recent developments and hear how our technology impacts the industry with Highcon’s tool-free die cutting capabilities and zero lead time. We will show a range of applications possible with digital die cutting for corrugated packaging and display and are expecting some great conversations on our upgraded Highcon Beam 2C, Highcon Beam 2C Nonstop and Beam Writer.
Make sure you visit us at North America’s largest corrugated event to discuss the perfect fit for your production and customer requirements.
If you want to learn more, click here and we will contact you shortly.
We look forward to connecting with you soon!
Join Highcon at the UK Corrugated Industry Trade Show 2024 to explore innovative digital die cutting solutions
Highcon at ScanPack, the leading exhibition and meeting place for the Scandinavian packaging industry