Meet us at Innovative Packaging 2024, the annual conference for the solid board packaging industry.
This year’s event will be held at Jastrzębia Góra in Poland on October 15-16, 2024.
We’re happy to collaborate with our esteemed partner Digiprint for a panel discussion titled “From Concept to a Box: An Industrial Digital Line for Packaging Production.”
For more information about the event, click here or contact us at [email protected].
Highcon Systems will showcase digital innovations at Graphics Canada Expo 2025