Highcon is Exhibiting at ScanPack For the First Time!

  • blankOctober 22 - 25, 2024
  • blankGothenburg, Sweden
Highcon at ScanPack, the leading exhibition and meeting place for the Scandinavian packaging industry
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We are excited to present for the first time with our partner ScanTeco at ScanPack, the leading exhibition and meeting place for the Scandinavian packaging industry.

This year’s event will take place on the 22 – 25 of October at the Swedish Exhibition & Congress Centre in Gothenburg, Sweden.

ScanTeco has started to introduce Highcon’s digital die cutting solutions to Scandinavia and Baltic countries at the beginning of 2024 to meet the evolving demands of the Scandinavian folding carton and corrugated converting sector.

You can find us at booth #B02:01 and explore new opportunities with Highcon Digital die cutting technology.

For more information, contact us at [email protected] or visit the event website here.

We look forward to seeing you there!

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