NAPCO Purchases Highcon Beam 2 Digital Die Cutting System to Enhance Digital Packaging Capabilities

Meeting demand for cost-effective, customizable, quick-turn solutions with no tooling and faster lead times

Düsseldorf, Germany, 31 May, 2024 — Highcon Systems Ltd (TASE: HICN), a leading provider of digital die cutting and creasing systems, announced today at drupa 2024 in Düsseldorf, Germany, that NAPCO, has purchased a Highcon Beam 2 digital die cutting system for its Sparta packaging facility in North Carolina, USA. The acquisition marks a strategic move for NAPCO, a renowned player in the custom boxes and specialty packaging industry, which is committed to enhancing its digital production capabilities and broadening its range of products.

The Highcon system is set to be shipped after drupa, an international print and packaging exhibition that ends on 7th June 2024. NAPCO has been in the packaging industry since 1977 and has always been quick to adapt to changing trends in the market. By integrating Highcon’s digital die-cutting technology into their digital printing workflow, NAPCO has taken a significant step towards optimizing production agility and expanding its market reach.

Commenting on the acquisition, Rob Proffit, President of NAPCO USA said, “Eliminating the need for physical dies will significantly lessen the turn-time from order to delivery. It also allows unlimited structural creativity and design. As an extension to our existing digital packaging equipment, the Highcon will expand our current reach into digital finishing, broadening our range of products into other categories.”

Joe DeBoy, VP of Sales, NAPCO USA, added, “Today’s customers require cost-effective, customizable, quick-turn solutions. The Highcon delivers on all of this. With no tooling and quicker lead-times, this piece of equipment will allow us to capture most of the digital manufacturing we were losing previously. We’re very excited about the opportunities the Highcon will allow us to go after.”

Shannon Lawrence, Purchasing Manager at NAPCO, praised the digital die cutting capabilities of the Highcon Beam during pre-sale trials, saying, “We showed up with seven different jobs and each with different material. To our amazement they ran every job and thoroughly demonstrated their capabilities in about 6 hours. We were amazed at the efficiency and diversity of the Beam 2. We are looking forward to having this capability in our manufacturing arsenal. This will give us the ability to service our customers with a new level of speed to market.”

Highcon’s CEO, Shlomo Nimrodi, expressed his enthusiasm about the purchase. “NAPCO’s investment in our technology reflects their dedication to digitalizing their production and expanding their product offering. ” He went on to say, “Collaborating with industry pioneers like Rocky and his son Rob at NAPCO is a privilege. NAPCO has been leading specialty packaging for many years now, and with Highcon’s solution, they’re set to enhance productivity and broaden their array of specialty packaging offerings even more.”

NAPCO, established in 1977, leads the way in the manufacturing of custom boxes and presentation packaging. With a robust history of innovation and a deep commitment to quality and rapid service, NAPCO has become a name synonymous with excellence in the packaging industry across the United States. The company’s wide array of custom boxes and presentation packages serve a diverse client base with a promise of one-stop solutions and unparalleled craftsmanship.