We are excited to exhibit at the Packaging Innovations Show 2023 at the NEC, Birmingham, UK.

Meet us at stand N30 and learn how Highcon Beam and Highcon Euclid digital finishing systems, take paperboard packaging to the next level – advancing sustainability measures, eliminating conventional dies and enabling a streamlined workflow.

“We will show how the introduction of digital finishing can help meet the growing demand for boxes and highlight recent projects where our responsiveness to market requirements has helped to totally transform customer businesses, making packaging and display more agile, sustainable and engaging,” said Juergen Freier, General Manager and VP Sales at Highcon Europe.

For one-on-one meeting on site, fill in the form to the right.

For a free entrance ticket, click here.

See you soon!