We are excited to exhibit at Packaging Innovations & Empack 2025 at the NEC, Birmingham, UK.

Meet us at Hall 3A stand V86 and learn how Highcon’s digital die cutting solutions, take paperboard packaging and display to the next level – advancing sustainability measures, eliminating conventional dies and enabling a streamlined workflow.

Packaging Innovations & Empack, alongside Contract Pack & Fulfilment, is the UK’s premier event driving business and innovation across the packaging industry. Attendees can discover suppliers offering packaging solutions from design to advanced technology, including packaging e-commerce, fulfilment, labelling and processing. This unique event covers the full packaging journey, helping converters and brands evolve from concept to production.

For one-on-one meetings on-site, contact us.

For a free entrance ticket, click here.

See you soon!