DS Smith Leads Packaging Innovation with Installation of First Highcon Beam 3

Groundbreaking digital die cutting system to be installed to DS Smith Packaging France

Yavne, Israel, 17 June 2024 Highcon Systems Ltd (TASE: HICN), today announced that DS Smith, one of the largest paperboard packaging companies in the world, will be the first company in the world to install the groundbreaking Highcon Beam 3 digital die cutting system. This announcement was made following the Drupa 2024 trade fair, held in Düsseldorf, Germany, where the Highcon Beam 3 premiered for the first time.

„DS Smith is glad to start a new partnership with Highcon; innovation is in DS Smith’s DNA“ said Armand Chaigne, Managing Director – France & Spain Consumer, DS Smith Packaging Division. „The implementation of the laser-cut machine Beam 3 in one of our French sites is exciting. This project supports the growing demand for sustainable packaging solutions and allows DS Smith to continue delighting our customers.“

The Beam 3 has received praise for its innovation and enhancements, including increased productivity, high-quality output, and workflow improvements. This will enable DS Smith to meet its customers‘ fast turnaround and supply chain challenges, as well as to offer superior packaging solutions to its core customer segments.

„It’s been a huge privilege to work closely with the professional team at DS Smith to reach this important milestone,“ said Moti Vaknin, Highcon’s Key Account Manager.

Highcon collaborated with BHS Corrugated to make this investment possible at DS Smith.

„It’s hugely exciting to exit a successful drupa with such an important announcement,“ said Shlomo Nimrodi, Highcon’s CEO. „Adding DS Smith to Highcon’s list of industry-leading customers is a huge feather in our cap and gives enormous impetus to the Highcon team. I have no doubt that this will act as a helpful tailwind as we follow up on the show.”