Highcon to Showcase Latest Digital Die Cutting Systems at SuperCorrExpo

Visit the Sun Automation Booth for Highcon's Latest Innovations
blank
blank

Highcon to Showcase Latest Digital Die Cutting Systems at SuperCorrExpo 2024 on Sun Automation Booth 

Chesterfield, MO, August 13th,2024 — Highcon, a leading provider of digital die cutting and creasing systems, will showcase its latest innovations for mainstream corrugated packaging and display production at SuperCorrExpo 2024. Attendees can experience innovative packaging and display produced on the upgraded Highcon Beam 2C digital die cutting system and the Highcon Beam Writer at the Sun Automation Group booth, 1731, from September 8-12 at the Orange County Convention Center. Sun Automation is Highcon’s go-to-market partner in the US.

First introduced ahead of drupa in April 2024, Highcon’s new corrugated solutions, are designed to meet the evolving needs of the corrugated industry. These solutions offer a non-crush process, customizable packaging for rightsizing and light-weighting, and strength for shipping products in their boxes. They also enhance the unboxing experience, supporting brand owners. Highlights include e-commerce shipper boxes with single-use tamper evident locks, mono material inserts, and intricate cuts.

Both independent and integrated corrugated converters are utilizing Highcon technology to speed up time to market, increase profits, and enhance efficiency and sustainability. The most recent sale for corrugated packaging and display is to Durham Box in the UK, which has invested in the upgraded Highcon Beam 2C to boost productivity and efficiency across its operations, particularly in the e-commerce sector.

“The enthusiastic response from industry leaders to our advanced solutions highlights our commitment to meeting critical market needs for agility, on-demand manufacturing capabilities, sustainability and innovation. We are excited to lead the market in digital die cutting for corrugated packaging and display, driving growth and boosting profit margins,” said Kevin Kesselring, Director of Sales Americas. “I look forward to meeting attendees at SuperCorrExpo to explore how our new solutions can help them increase profits and achieve substantial growth and efficiency.”

For more information about Highcon’s innovative digital die cutting solutions, visit the Sun Automation Group Booth 1731 at SuperCorrExpo 2024.

Share Press Release post

More Press Releases

post-image
Highcon and Hybrid Software Collaborate to Enhance Digital Die Cutting Workflow Efficiency

Integrating Hybrid's renowned PACKZ software offering full PDF support

More Info
post-image
Highcon at FACHPACK 2024

Discover the SEALED AIR® Korrvu® packaging produced with Highcon

More Info
post-image
Highcon Announces CEO Transition following Successful drupa

Shlomo Nimrodi to be succeed by Yair Alcobi on 1 August and to assume Active Chairman role

More Info
Ir al contenido